PCB Component fixation for glue

Powering Innovation with Reliability

Adhesive supplier

Adhesive (Shanghai) Co., Ltd. is a professional factory that has been deeply engaged in the field of hot melt adhesives for several years. With its focus on and innovation in adhesive technology, it has developed into a leader in the industry. We have advanced R&D equipment and an experienced R&D team who are constantly exploring new formulas and new application scenarios for hot melt adhesives, and are committed to providing customers with high-quality, customized adhesive solutions. From the strict screening of raw materials, to the fine control of the production process, to the strict quality inspection of finished products, we always hold ourselves to the highest standards to ensure that each batch of products can stably and reliably provide solid support for the fixation of PCB components.

Great-Adhesive Production Process

Our production process follows strict standards and specifications to ensure the excellent performance of hot melt adhesives.
First of all, we select high-quality raw materials such as base resins and tackifying resins. These raw materials have undergone strict quality inspections and meet international standards. In the batching process, they are mixed according to precise formula ratios to ensure that the various ingredients are evenly distributed, laying a good foundation for subsequent production.
Then enter the melting stage, under specific temperature and stirring conditions, the mixture is fully melted to form a uniform hot melt adhesive melt.
Then fine filtration is carried out to remove impurities to ensure the purity of the colloid and prevent impurities from affecting the adhesive effect or clogging application equipment such as glue guns. After cooling and curing, cutting and packaging are carried out according to customer needs.
The packaging materials also have good moisture-proof and anti-pollution properties to ensure that the quality of the product is not affected during storage and transportation. The entire production process is monitored by professional technicians to ensure that each link reaches the optimal state.

Contact Us: Your Gateway to Expert Solutions

If you are interested in our hot melt adhesive products or have any questions, please feel free to contact us. You can contact us in the following ways:

Phone: +86 15618525178
Email: emily.gu@great-adhesive.com

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Problem and solution

Uneven hot melt adhesive coating
Reason: The glue gun nozzle is clogged or damaged, the glue temperature is uneven, and the glue has poor fluidity.
Solution: Check and clean the glue gun nozzle regularly, and replace it in time if it is damaged; preheat the glue to the appropriate temperature range before use, and keep the heating equipment running stably to avoid temperature fluctuations; choose glue with appropriate viscosity, and adjust the formula or add an appropriate amount of diluent for glue with poor fluidity (but ensure that it does not affect the performance of the glue) to improve its fluidity.

Displacement after component fixation
Reason: The glue is disturbed by external force before curing, the amount of glue applied is insufficient, and the glue has poor adhesion to the surface of the component or PCB board.
Solution: Optimize the production process to ensure that the components are not affected by external forces before the glue is cured, such as avoiding vibration of the production line and accidental contact by personnel; accurately calculate the amount of glue applied according to the size and shape of the components to ensure that there is enough glue to bond the components; clean the PCB board and the surface of the components before use to remove impurities such as oil, dust, etc. If necessary, pre-treat the surface such as polishing and activation to improve the adhesion of the glue.

Glue brittle crack after curing
Reason: Too fast curing speed leads to excessive internal stress, the glue formula is not suitable for the application scenario, and the ambient temperature and humidity change too much.
Solution: Adjust the curing parameters of the glue, such as lowering the temperature and extending the curing time, so that the glue can be fully cross-linked without generating excessive internal stress; select the appropriate glue formula according to the actual application scenario, for example, for PCBs that need flexibility to adapt to frequent bending (such as circuit boards in wearable devices), choose a hot melt adhesive formula with high elasticity; control the stability of the ambient temperature and humidity during the glue curing process to avoid affecting the glue performance due to excessive environmental changes.