
pressure sensitive hot melt glue
High-performance thermal adhesive to meet your diverse needs
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About Pressure Sensitive Hot Melt Glue
Pressure sensitive hot melt glue, also widely known as hot melt pressure sensitive adhesive (HMPSA), is an innovative thermosensitive adhesive integrating features of heat-activated hot melt adhesive and pressure-triggered PSA. Once heated and melted, this industrial adhesive can be rapidly coated onto substrate surfaces. After cooling, it creates a tacky adhesive layer with both thermosensitive and pressure-sensitive performance. Its tackiness can be modified through secondary heating, while light pressure delivers instant bonding. Our HMPSA solutions serve a wide range of industrial manufacturing scenarios.
Key Advantages:
- Cures within 3 seconds after cooling
- High bonding strength
- Excellent peel and shear resistance
- Environmentally friendly and safe
- 100% solid content formula
- Low odor, non-toxic composition
- Compatible with spray coating, roll coating and bead dispensing processes
pressure sensitive hot melt glue
Adhesive (Shanghai) Co. Ltd.
Innovative Technology of Pressure Sensitive Hot Melt Glue
As an industry benchmark for heat-activated bonding technology, our pressure sensitive hot melt glue (HMPSA) series developed by Adhesive (Shanghai) Co. Ltd redefines the precision and efficiency of temperature-responsive bonding. Featuring an accurate temperature-controlled bonding mechanism, this hot melt pressure sensitive adhesive delivers innovative solutions for reversible bonding and residue-free peeling, widely applied in medical devices, smart packaging and precision electronics manufacturing.
- 45℃-60℃: Temporary positioning adhesion (0.5-1.2 N/cm²)
- 70℃-90℃: Permanent bonding strength (5-8 N/cm²)
- Above 100℃: Controllable peeling mode (residual rate <0.3%)
Within the temperature range of 50°C–120°C, the adhesive layer of our PSA hot melt adhesive achieves an intelligent transition from solid state to viscous flow state in only 3 seconds, fully satisfying high-speed bonding demands for automated industrial production lines.We customize grades of hot melt pressure sensitive adhesive to match different working temperature requirements across various manufacturing sectors.
| Item | Parameter |
|---|---|
| Product Name | Hot Melt Pressure Sensitive Adhesive (HMPSA) |
| Appearance | Transparent yellow/orange solid block |
| Solid Content | 100% |
| Working Temperature Range | 45℃ – 120℃ |
| Temporary bonding strength | 0.5–1.2 N/cm² (45–60℃) |
| Permanent bonding strength | 5–8 N/cm² (70–90℃) |
| Peeling residue rate | <0.3% (>100℃) |
| Application Methods | Roll coating, spray coating, dispensing |
Application Fields of Pressure Sensitive Hot Melt Glue
- Electronic industry: Temporary fixation of flexible circuit boards (FPCs) and encapsulation of display components with pressure sensitive hot melt glue.
- Packaging field: Carton sealing and label lamination. Our hot melt pressure sensitive adhesive fits perfectly for high-speed automated production lines.
- Medical equipment: Disposable medical dressings and catheter fixation. This HMPSA meets strict biocompatibility requirements for skin-contact applications.
- Industrial manufacturing: Long-term bonding scenarios including automotive interior assembly, filter material lamination, and shoe material lamination.
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Submit your requirements by email to info@great-adhesive.com, or WhatsApp +86-15618525178.
We will recommend the model and adhesive process parameters to you. After getting the delivery address, we will ship it within 7 days. When you pass the peeling force, stickiness, heat resistance and other tests, you can enjoy a 10% special discount for the first annual order.













